-- Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization (STCO) approach. -- The study allows to identify and mitigate thermal ...
3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced ...
AI-based workflows aid advanced node designs, ensuring design and system technology co-optimization for HPC and AI applications / Key Highlights TSMC and Ansys advance AI-assisted workflows to support ...
Cadence, a maker of chip design software, and Intel Foundry will collaborate on "Design Technology Co-Optimization" in a multi-year agreement beginning with Intel's upcoming 14A semiconductor ...
A new technical paper titled “System-Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by researchers at imec, INESC-ID, Université ...
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Why Wall Street Loves Cadence Design Systems Stock Here
Shares of electronic design automation Cadence Design Systems (CDNS) found themselves back in the spotlight on June 8 after ...
Holistic system-technology co-optimization (STCO) approach key in reducing peak GPU and HBM temperatures under AI workloads while enhancing performance density of future GPU-based architectures Imec ...
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